Automatic Single Wafer metal lift off equipment
SPM produces full automatic metal lift-off equipment tailored according customer needs.
Wafer size could be from 3” up to 8”. An automatic robot handle wafers one by one loading into process chamber(s) catching them from carrier.
The complete process is executed into a single chamber:
- Metal Lift-off;
- Rinse;
- Dry with high speed spinner.
Metal lift off tank
The metal lift off tank we projected is entirely realised in PTFE and includes:
- Rotational plateau with brushless servomotor (adjustable speediness till 5000 rpm max), with vacuum for wafer hold;
- Automatic cover with electric actuator; integrating automatic door opening and Megasonic transducer passage;
- “Megpie” Megasonic transducer at 1 MHz frequency;
- Two axis programmable, electric manipulator for Megasonic transducer movement from home position; H2ODI recirculation inside the tank with continuous overflow;
- H2ODI/other solution nozzles automatic movement; programmable position, speed and frequency electric axis;
- Lift Off solution inlet at controlled temperature; solution comes from the buffer tank, by pump;
- High pressure pump for metal residual removal.
Gallery
